Quantum NanoFab Core Facility

Quantum NanoFab Core Facility

Institution
University of Waterloo
Address

Mike and Ophelia Lazaridis Quantum-Nano Centre (QNC), 
200 University Avenue West

Waterloo, ON N2L 3G1
General contact
Melissa Floyd
Finance and Administration

Institute for Quantum Computing

T: (519) 888-4567 x39026
E: mmfloyd@uwaterloo.ca
Research contact
Vito Logiudice
Director

Institute for Quantum Computing

T: (519) 888-4567 x38703
E: vlogiudi@uwaterloo.ca
Lab/facility website: https://fab.qnc.uwaterloo.ca
Published date: Jun 26, 2017
What the lab/facility does

Nanofabrication cleanroom enabling the design and fabrication of a broad range of quantum and nano-scale devices.

Sectors of Application
Information and communication technologies and media; Life sciences, pharmaceuticals and medical equipment; Manufacturing and processing
Area(s) of expertise

The University of Waterloo’s Quantum NanoFab infrastructure includes several class 10 through class 1000 cleanroom modules as well as multiple satellite labs which together house a broad range of state-of-the-art nanofabrication, packaging and assembly lab equipment. Professionally staffed and operated, the facility provides extensive safety, cleanroom and hands-on equipment training as well as guidance on advanced process technologies ranging from atomic layer deposition to electron beam lithography capable of reliably patterning features down to 8nm. Each individual piece of equipment is characterized by well-documented and communicated materials limitation which mitigate cross-contamination risks. All equipment is physically interlocked with a centralized lab management software platform and each features a revision-tracked Standard Operating Procedure (SOP). This ensures proper & consistent equipment use. An extensive and growing list of characterized, qualified and well-documented processes is also available to all lab members as an additional aid in the development of their unique nanofabrication process flows. Significant process engineering expertise is available in-house to help members make best use of the facility & its many well-controlled and novel capabilities.

Research Services

The facility is open to all graduate researchers from across Canada as well as to government labs & private industry. Interested parties must complete all prerequisites prior to being granted member status. Prospective members must complete an initial process review via our process engineering group to confirm feasibility of their proposed process before proceeding. This initial service is provided free of charge. Training on distinct pieces of equipment is provided on an as-needed basis per the new member’s requirements. Limited device fabrication services may become available in the future.

Specialized labs and equipment

Name of specialized lab

Name of equipment in use

Description of function

DEPOSITION

ALD/PECVD Cluster

Deposition of various thin films via ALD and PECVD

 

Evaporator: E-beam & thermal

Physical Vapour Deposition of thin films via e-beam and resistive heating thermal evaporation

 

LPCVD LTO

Low temperature oxide & doped oxide deposition via LPCVD

 

LPCVD Poly Si

Deposition of doped & undoped films of polysilicon via LPCVD

 

LPCVD Silicon Nitride

Low stress silicon nitride deposition via LPCVD

 

Oxidation - silicon

Wet or dry thermal oxidation and thermal anneal (silicon)

 

Rapid Thermal Processor

Short duration, high-temperature processing of 4" or 6" wafers

 

Sputter: Nb Superconducting Films

Physical Vapour Deposition of superconducting films of Nb via sputter deposition

 

Sputter: Twin Chamber

Physical Vapour Deposition of thin films via sputter deposition

LITHOGRAPHY

Beamer/Tracer SW suite

Comprehensive SW platform for preparing data for exposure on JEOL JBX-6300FS EBL

 

E-Beam Litho 30kV (Raith)

Patterning nanometer scale features via electron-beam lithography

 

E-Beam Litho 100kV (JEOL)

Patterning nanometer scale features via electron-beam lithography

 

Mask Aligner: Front/Back Capable

Alignment and UV exposure of resist-coated wafers

 

Oven: Convection

Baking of various photoresist films

 

Oven: HMDS & Image Reversal

Vapour priming substrates with HMDS ( adhesion promoter) prior to photoresist coat & image reversal

 

Spin Coat: Dual general purpose

Spin coating of various photoresist and a restricted variety of routine semiconductor films

 

Spin Coat: E-Beam Resist Station

Spin coating of E-beam photoresist films

 

Spin Coat: UV Resist Station

Spin coating of UV photoresist films

DRY ETCH

Ion Mill

Etching of thin films via Ar ion milling

 

Photoresist Stripper

Photoresist strip & descum

 

RIE: Deep Si (includes Bosch process)

Plasma-based dry etching of silicon

 

RIE: Metals & III-V

Plasma-based dry etching of metal thin films and III-V substrates (GaAs & InP)

WET BENCHES

Bulk Silicon Etch

Bulk wet silicon etch via solutions of KOH

 

Diffusion Pre-Clean

Wafer clean via RCA chemistries

 

E-Beam Resist Develop

Development of e-beam resist coated substrates

 

HF Acids ONLY

Bulk wet silicon oxide etch via solutions of HF

 

Non-HF Acids & Bases

Dedicated for acid (non HF) or base processes and cleans

 

Piranha Organics Clean & Resist Strip

Photoresist strip using solutions of sulphuric acid & H2O2

 

Solvent Processing #1

Photoresist develop & lift-off

 

Solvent Processing #2

Photoresist develop & lift-off

 

UV Resist Develop

Development of UV resist coated substrates

CHARACTERIZATION

4-point probe

For measuring resistivity of thin metal films and doped semiconductors

 

Electrical Probe Station

For measuring electrical characteristics of devices

 

Ellipsometer

Non-destructive optical characterization of thin films

 

Microscope #1

Versatile Olympus MX61A semiconductor microscope for inspecting and documenting

 

Microscope #2

Versatile Olympus MX61A semiconductor microscope for inspecting and documenting

 

Reflectometer: Thin Film Mapping

Mapping transparent thin film thicknesses across wafers with diameters up to 200mm

 

Reflectometer: Thin Film Spot Measurement

Reflectometer for spot-measuring transparent thin film thicknesses

 

Surface Profiler

Veeco Dektak 150 surface profiler

 

Wafer Stress Measurement

Characterizing thin film stress

DEVICE PACKAGING LAB

Convection Cure Oven

Baking of various epoxies/packages in ambient atmosphere

 

Dicing Saw

Tool is used to cut semiconductor wafers into individual chips or dies

 

Die Bonder

Bonding of semiconductor dies to packages

 

H2 Plasma Cleaner

Used for cleaning samples prior to die bonding, wire bonding or encapsulation processes

 

Measurement Microscope

Olympus STM6 microscope for inspection and dimensional measurement of finished semiconductor dies

 

Wire Bonder: Manual Wedge/Ball

For making electrical contacts between semiconductor dies and packages

 

Wire Bonder: Semi-automatic Wedge

For making electrical contacts between semiconductor dies and packages

 

Wire Pull Tester

West-Bond 70PTC to enable destructive and nondestructive testing of wire bonds by the pull test method

 


Quantum NanoFab Dry Etch & Deposition Module

Credit: Dan Schwalm, HDR Architecture


Quantum NanoFab Deposition & Chemical Process Module

Credit: Dan Schwalm, HDR Architecture


Quantum NanoFab UV Lithography Module

Credit: Dan Schwalm, HDR Architecture


Quantum NanoFab Southwest Service Chase

Credit: Dan Schwalm, HDR Architecture

Additional Information

Title

URL

New Electron Beam Lithography equipment at Quantum NanoFab

https://uwaterloo.ca/institute-for-quantum-computing/blog/post/new-elect...

Nano-scale Canadian flag sets world record in lead-up to nation's 150th birthday

https://phys.org/news/2016-09-nano-scale-canadian-flag-world-lead-up.html

Ultrastrong coupling of a single artificial atom to an electromagnetic continuum in the nonperturbative regime

http://www.nature.com/nphys/journal/v13/n1/full/nphys3905.html#acknowled...