Quantum-Nano Fabrication and Characterization Facility (QNFCF)

Deposition (QNC building)

ALD/PECVD Cluster

Deposition of various thin films via ALD (Atomic Layer Deposition) and PECVD (Plasma-Enhanced Chemical Vapor Deposition)

E-beam and thermal Evaporators

Physical Vapour Deposition of thin films via e-beam and resistive heating thermal evaporation (2 systems)

LPCVD Furnace for LTO

Low Pressure Chemical Vapor Deposition (LPCVD) furnace for deposition of  doped and undoped low temperature oxides (LTO)

LPCVD Furnace for Poly Si

LPCVD deposition of dopedand undoped films of polysilicon via LPCVD

LPCVD Furnace for Silicon Nitride

LPCVD deposition of low stress silicon nitride

 Atmospheric Furnace

Wet or dry thermal oxidation of silicon substrates

Rapid Thermal Processors

Short duration, high-temperature processing of 4" or 6" wafers (2 systems)

UHV Al Angle Evaporator

Physical Vapour Deposition of Aluminum thin films for Josephson Junction fabrication

Twin Chamber Sputter

Physical Vapour Deposition of thin films via sputter deposition

Thermal Evaporator for Au and AuBe thin films

Fabrication of P-type ohmic contacts for III-V materials 

Lithography (QNC building)

JEOL JBX-6300FS 100kV E-Beam Litho System

Patterning nanometer scale features (down to 8nm) via electron-beam lithography

Beamer/Tracer SW suite

Comprehensive software platform for preparing data for exposure on JEOL JBX-6300FS E-Beam Litho System

RAITH E-Beam Litho 30kV

Patterning nanometer scale features (down to 20nm) via electron-beam lithography

UV Direct Write Lithography System

Maskless alignment and UV exposure of resist-coated substrates (includes backside alignment capability)

Mask Aligner

Alignment and UV exposure of resist-coated substrates (includes backside alignment capability for two wafer stack pre-alignment and clamping prior to wafer bonding)

Wafer Bonder

Permanent bonding of wafers (both bare and patterned)

Convection Oven

Baking of various photoresist films

HMDS/Image Reversal Oven

Vapour priming substrates with HMDS (adhesion promoter) prior to photoresist coat and image reversal

Spin Coater: Dual general purpose

Spin coating of various photoresists and a restricted variety of routine semiconductor films

Spin Coater: E-Beam Resist Station

Spin coating of E-beam photoresist films

Spin Coater: UV Resist Station

Spin coating of UV photoresist films

Dry Etch (QNC building)

Ion Milling Machine

Etching of thin films via Ar ion milling

Photoresist Stripper

Photoresist strip and descum

Reactive Ion Etch (RIE) System: Deep Si (includes Bosch process)

Low and high aspect ratio etching of silicon via plasma-based dry etching

Reactive Ion Etch (RIE) System: Metals and III-V

Plasma-based dry etching of metal thin films and III-V substrates (GaAs & InP)

Wet Benches (QNC building)

Bulk Silicon Etch Wet Bench

Wet bulk silicon etch using KOH solutions

Pre-Diffusion Clean Wet Bench

Wafer clean via RCA chemistries

E-Beam Resist Develop Wet Bench

Development of e-beam resist coated substrates

HF Acids Hood Wet Bench

Wet bulk silicon oxide etch using HF solutions

Non-HF Acids and Bases Wet Bench

Dedicated to acid (non HF) or base processes and cleans

Piranha Organics Clean and Resist Strip Wet Bench

Photoresist strip using mixtures of sulphuric acid and hydrogen peroxide

Solvent Processing (2 hoods) Wet Bench

Photoresist develop and lift-off

UV Resist Develop Wet Bench

Development of UV resist-coated substrates

Characterization (QNC building)

Scanning Electron Microscope (SEM)

Nanoscale viewing of substrates with Energy Dispersive Spectroscopy (EDS) material analysis capability

Atomic Force Microscope (AFM)

Scanning probe microscopy for measuring substrate surface roughness, etc.

SEM/FIB System

Focussed Ion Beam (FIB) milling of substrates and TEM sample preparation

Scanning/Transmission Electron Microscope (S/TEM)

Atomic scale viewing and characterization of a broad range of materials. Equipped with Energy Dispersive Spectroscopy (EDS) and Electron Energy Loss Spectroscopy (EELS) analytical capabilities

Four-point probe

For measuring resistivity of thin metal films and doped semiconductors

Electrical Probe Stations (2 systems)

For measuring electrical characteristics of devices

Ellipsometer

Non-destructive optical characterization of thin films

Semiconductor microscopes (2 units)

Versatile microscope for inspecting and documenting samples and devices

Thin Film Mapping Reflectometer

Mapping transparent thin film thickness across wafers (diameters of up to 200mm)

Thin Film Spot Measurement Reflectometer

Precise spot-measurement of transparent thin film thickness

Stylus Surface Profiling Systems (2 units)

Measurement of surface topography and thin film step heights

Thin Film Stress Measurement System

Measurement and mapping of thin film stress on wafers

Device Packaging Lab (QNC building)

Convection Cure Oven

Baking of various epoxies/packages in ambient atmosphere

Dicing Saw

Precision cutting of wafers into individual chips/dies

Die Bonder

Bonding of chips/dies to packages

H2 Plasma Cleaner

Cleaning samples and/or chips prior to die bonding, wire bonding or encapsulation processes

Measuring Microscope

For inspection and dimensional measurement of finished chips/dies

Manual Wedge/Ball Wire Bonder

For making electrical contacts between semiconductor dies and packages

Semi-automatic Wedge Wire Bonder

For making electrical contacts between semiconductor dies and packages

Wire Pull Tester

Destructive and nondestructive testing of wire bonds by the pull test method

 Clean Assembly Lab (RAC1 building)

Class 1000 Cleanroom Work Stations (2 reservable stations)

Clean assembly of scientific instruments and assemblies

Environmental Test Chamber

Convection chamber for thermal stress testing of devices and components

Fume Hoods (3)

Safe wet chemical processing of solvent and acid solutions

Laser Welder

Manual laser fusion welding

Plasma cleaner

Dry cleaning of substrates using argon or oxygen plasmas

Microscopes (3)

General purpose inspection

Sample Cutter

Precision, low speed cutting of various substrate types

Sample Polisher

Precision polishing of various substrate types

Manual Wedge/Ball Wire Bonder

For making electrical contacts between semiconductor dies and packages

Optical Metrology System

Optical (non-contact) 3D surface characterization of substrates & devices

Specialty Labs (RAC2 building)

LPCVD Furnace

For Carbon Nanotube (CN) and Graphene thin film growth

Optical Fiber Splicer

Resistive filament-based, automatic glass processing and fusion splicing system

PLD Deposition System

Precise growth of a wide range of thin films via Pulsed Laser Deposition (PLD)